Displacement-Type Solder Plating for SMT Board.
نویسندگان
چکیده
منابع مشابه
Mapping the failure envelope of board-level solder joints
Single solder interconnects were subjected to a series of combined tension–shear and compression–shear tests to determine their failure load. The failure envelope of these interconnects was obtained by plotting the normal component against the shear component of the failure load. The interconnect failure force map was found to be elliptical like the failure envelopes of many materials. The fail...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1993
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.44.1158